特点:
● 低介电常数 (Dk 4.05@10GHz)
● 低介质损耗 (Df 0.0070@10GHz)
● Tg 200℃无铅兼容板材
● 低 Z 轴膨胀系数及优异通孔可靠性
● 低吸水率
FEATURES:
● Low Dk (Dk 4.05@10GHz)
● Low loss (Df 0.0070@10GHz)
● Tg 200℃, Lead-free compatible
● Low Z-CTE, offering superior PTH reliability
● Low moisture absorption
应用领域:
● 路由器
● 服务器
● 基站
● 存储
APPLICATIONS:
● Router
● Server
● Base Station
● Storage
特点:
● 低介电常数 (Dk 4.20@10GHz)
● 低介质损耗 (Df 0.0070@10GHz)
● Tg 200℃(TMA) 无卤无铅兼容
● 低 Z 轴膨胀系数 (1.1%) 及优异通孔可靠性
FEATURES:
● Low Dk (Dk 4.20@10GHz)
● Low Df (Df 0.0070@10GHz)
● Tg 200℃(TMA) Halogen-free and Lead-free compatible
● Low Z-CTE(1.1%), offering superior PTH reliability
应用领域:
● 存储
● 服务器
● 基站
● 汽车电子
● HDI,SiP
APPLICATIONS:
● Storage
● Server
● Base Station
● Automobile electronics
● HDI,SiP