NY9720 LD
低膨胀系数/高Tg/高模量
低Dk /低Df
优异通孔可靠性及PCB加工性
低吸水率
无卤
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天线封装Aip
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射频系统级封装RF SiP
NY9720 LD基板典型性能 Typical Properties for NY9720 LD Laminate
| Property | Item | IPC-TM-650 | Test Condition | Unit | Typical Value | |
| Thermal | Glass Transition Temperature | 2.4.24 | TMA | ℃ | 210 | |
| 2.4.24.4 | DMA | ℃ | 250 | |||
| X/Y-axis CTE | 2.4.24.5 | ＜Tg,TMA | PPM/℃ | 10 | ||
| Z-axis CTE | 2.4.24 | ＜Tg,TMA | PPM/℃ | 30 | ||
| ＞Tg,TMA | PPM/℃ | 175 | ||||
| 2.4.24 | 50~260℃ | % | 1.5 | |||
| Decomposition Temperature | 2.4.24.6 | TGA(5%W.L) | ℃ | 430 | ||
| T288 Thermal Resistance | 2.4.24.1 | Clad | Min | ＞60 | ||
| Etched | Min | ＞60 | ||||
| Electrical | (R/C:50%) Permittivity | 1GHz | 2.5.5.9 | C-24/23/50 | — | 3.5 |
| 10GHz | SPDR method | 3.4 | ||||
| (R/C:50%) Loss Tangent | 1GHz | 2.5.5.9 | C-24/23/50 | — | 0.0025 | |
| 10GHz | SPDR method | 0.0035 | ||||
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ-cm | 1.0×109 | ||
| Surface Resistivity | MΩ | 1.0×108 | ||||
| Physical | Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
| (VLP) Peel Strength | Toz | 2.4.8 | As Received | N/mm | 0.7 | |
| Flexural Modulus | GB / T 9341-2018 | @RT | Gpa | 24/25 | ||
| Young's Modulus | GB / T 1040.1-2018 | @RT | Gpa | 24/25 | ||
| Flame Resistance | UL-94 | A&E-4/125 | — | V-0 | ||
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