Innovative R&D
R&D Center Vision
Guided by market demand and driven by technological leadership, we have established a product portfolio featuring “first-generation mass production, second-generation under development, and third-generation in pre-research.” This enables rapid response and fulfillment of customer needs while developing high-value-added advanced materials with the distinctive characteristics of NOUYA New Materials.
-
Establishing industry-academia-research collaboration models with renowned universities such as Tongji University, with a focus on achieving breakthroughs and building research reserves.
-
Exceptional supply chain collaboration capabilities, integrating resources and jointly developing customized solutions.
-
Establishing an efficient material validation platform has significantly boosted new product development efficiency and enabled rapid response to customer needs.
Innovations in Copper-Clad Laminate Technology
NOUYA core technology provides you with a powerful computing power foundation.
-
Innovative Technical Solutions for Copper-Clad Laminates -
Domestically produced, fully controllable, full-series materials -
Innovation Empowers PCB Industry Upgrades -
Establishing a Dual-Drive Model for Quality and Cost -
One-Stop R&D Service Platform
Key Points of Core Material Technology
High-Speed Materials: Optimized formulation processes reduce dielectric loss (Df), enhance thermal resistance and reliability, ensuring signal integrity and stability during transmission to meet the demands of 5G communications, servers, and high-speed terminal devices.
High-Frequency Materials: Focused on low dielectric constant (Dk) to minimize signal delay, serving applications such as high-frequency communications (e.g., millimeter-wave and terahertz bands for 5G/6G).
Automotive Materials: Enhance resistance to CAF, heat, high voltage, and toughness; integrate thick copper with flexibility; achieve high-frequency and high-speed reliability; develop substrates meeting electric vehicle and high-reliability automotive electronics demands.
HDI and Packaging Substrate Materials: Research to improve dimensional stability, optimize electrical properties, and develop ultra-thin processes; create halogen-free, eco-friendly HDI materials; Breakthroughs in IC packaging substrate technology featuring high Tg, high modulus, low expansion, and low Dk/Df to meet demands for high integration and smart LED applications.
Thermal Interface Materials: Develop materials combining excellent reliability (e.g., CAF resistance), superior thermal conductivity, and compatibility with HDI manufacturing processes to address thermal challenges arising from miniaturization and high power density in electronic devices.
-
Electronically Reinforced Glass Fiber Fabric Composite Technology
Design optimized application solutions for fiberglass cloth, conduct research and adaptation of formulation systems, and achieve comprehensive application of various types of fiberglass cloth.
-
High-Performance Resin Composite Technology
Conduct in-depth research on resin reactivity, optimize the process window, and enhance product consistency and reliability.
-
Interface Application Technology for Fillers
By employing surface modification techniques and filler blending strategies, the interfacial compatibility between inorganic fillers and organic resins is enhanced.
-
Innovative Formula Design Technology
Research on multi-group distribution ratio optimization and synergistic effects to achieve precise control of material properties
-
Key Technologies for Molecular Design and Structural Optimization
Achieving fundamental innovation in material properties through precision design and optimization at the molecular level
-
Design optimized application solutions for fiberglass cloth, conduct research and adaptation of formulation systems, and achieve comprehensive application of various types of fiberglass cloth.
-
Conduct in-depth research on resin reactivity, optimize the process window, and enhance product consistency and reliability.
-
By employing surface modification techniques and filler blending strategies, the interfacial compatibility between inorganic fillers and organic resins is enhanced.
-
Research on multi-group distribution ratio optimization and synergistic effects to achieve precise control of material properties
-
Achieving fundamental innovation in material properties through precision design and optimization at the molecular level
Unique Craftsmanship
-
IPD-Based Product and Technology Development Model -
Configured comprehensive performance testing equipment and established full-spectrum testing capabilities. -
Resin modification technology and dispersion technology for micron/nanometer-sized particles have established a high-filler-content processing system. -
Unique immersion technology and high-precision coating technology ensure Anti-CAF performance and thickness uniformity. -
Ultra-Thin Bonding Sheet (10μm) Manufacturing Process -
Unique immersion technology and high-precision coating technology ensure Anti-CAF performance and thickness uniformity. -
Ultra-Thin Bonding Sheet (10μm) Manufacturing Process
Performance Enhancement Measures
-
1
-
2
-
3
-
4
-
Enhanced Electrical Performance
Reduce signal transmission loss and enhance electrical performance
-
Enhanced Physical Properties
Enhance mechanical properties, improve thermal conductivity, and optimize dimensional stability
-
Chemical Properties Provided
Enhancing chemical resistance and solderability
-
Environmental Performance Enhancement
Meet environmental requirements and enhance environmental resistance
Technical Achievements and Awards
Technological innovation continues to achieve breakthroughs, empowering industrial upgrading at multiple levels.
-
115Number of Patents
-
8National Standard
-
24ChapterAcademic Papers
