NY8320NSF/NY8320NSFP

高Tg、低膨胀系数、高模量
优秀的耐热性及耐CAF性能
优异通孔可靠性及PCB加工性
无卤

NY8320NSF基板典型性能 Typical Properties for NY8320 NSF Laminate

Property	Item		IPC-TM-650	Test Condition	Unit	Typical Value

Thermal	Glass Transition Temperature		2.4.25	DSC	℃	\
			2.4.24	TMA	℃	220~240
			2.4.24.4	DMA	℃	260~290
	（1078×2） X/Y-axis CTE		2.4.24.5	＜Tg,TMA	PPM/℃	5
	（2116×8） Z-axis CTE		2.4.24	＜Tg,TMA	PPM/℃	10
				＞Tg,TMA	PPM/℃	55
			2.4.24	50~260℃	%	0.4~0.6
	Decomposition Temperature		2.4.24.6	TGA(5%W.L)	℃	430
	Thermal Resistance		2.4.24.1	Clad	Min	＞60
				Etched	Min	＞60
Electrical	(R/C:50%) Permittivity	1MHz	2.5.5.9	C-24/23/50	—	\
		1GHz				4.3
		10GHz	SPDR method			4.1
	(R/C:50%) Loss Tangent	1MHz	2.5.5.9	C-24/23/50	—	\
		1GHz			—	0.006
		10GHz	SPDR method			0.007
	Volume Resistivity		2.5.17.1	C-96/35/90	MΩ-cm	1.0×10⁹
	Surface Resistivity				MΩ	1.0×10⁸
Physical	Water Absorption		2.6.2.1	E-1/105+D-24/23	%	0.11
	(HTE) Peel Strength	Toz	2.4.8	As Received	N/mm	\
	(RTF) Peel Strength	Toz				\
	(VLP) Peel Strength	Toz				0.7
	Flexural Modulus		GB / T 9341-2018	@RT	Gpa	31\32
	Young's Modulus		GB / T 1040.1-2018	@RT	Gpa	31\32
	Flame Resistance		UL-94	A&E-4/125	—	V-0

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