NY-P4N/NY-P4PN
低介电常数和低介质损耗（Low Dk 3.22@10GHz，Low Df 0.0014@10GHz）
优异的电气和热可靠性 Excellent electrical and thermal reliability properties
优异的防潮性和无铅回流焊工艺兼容 Excellent moisture resistance and lead Free reflow process compatible
优越的PTH可靠性和耐CAF能力 Superior PTH reliability and anti-CAF capability
Dk/Df性能稳定平坦，防潮性能优异Stable and flat Dk
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射频RF
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服务器Server
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基站Base Station
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背板Backplane
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高性能计算机High Performance Computer
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超级核心路由器和交换机Super Core Router and Switchers
NY-P4N基板典型性能 Typical Properties for NY-P4N Laminate
| 属性 Property | 项目 Item | 测试方法 IPC-TM-650 | 测试条件 Test Condition | 单位 Unit | 典型值 Typical Value | |
| 热性能 Thermal | 玻璃态转换温度 Tg Glass Transition Temperature | 2.4.25 | DSC | ℃ | \ | |
| 2.4.24 | TMA | ℃ | 170 | |||
| 2.4.24.4 | DMA | ℃ | 200 | |||
| X/Y轴热膨胀系数 X/Y-axis CTE | 2.4.24.5 | ＜Tg,TMA | PPM/℃ | 17/18 | ||
| Z轴热膨胀系数 Z-axis CTE | 2.4.24 | ＜Tg,TMA | PPM/℃ | 50 | ||
| ＞Tg,TMA | PPM/℃ | 270 | ||||
| 2.4.24 | 50~260℃ | % | 3.0 | |||
| 热分解温度 Td Decomposition Temperature | 2.4.24.6 | TGA(5%W.L) | ℃ | 400 | ||
| 耐热性 T288 Thermal Resistance | 2.4.24.1 | Clad | Min | ＞120 | ||
| Etched | Min | ＞120 | ||||
| 电性能 Electrical | 介电常数 Dk (R/C:66%) Permittivity | 1MHz | 2.5.5.9 | C-24/23/50 | — | \ |
| 1GHz | \ | |||||
| 10GHz | SPDR method | 3.22 | ||||
| 介质损耗 Df (R/C:66%) Loss Tangent | 1MHz | 2.5.5.9 | C-24/23/50 | — | \ | |
| 1GHz | — | \ | ||||
| 10GHz | SPDR method | 0.0014 | ||||
| 体积电阻 Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ-cm | 2.4×109 | ||
| 表面电阻 Surface Resistivity | MΩ | 1.9×108 | ||||
| 物理性能 Physical | 吸水率 Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.06 | |
| 剥离强度(HTE) Peel Strength | 1oz | 2.4.8 | As Received | N/mm | \ | |
| 剥离强度(RTF) Peel Strength | 1oz | \ | ||||
| 剥离强度(HVLP) Peel Strength | 1oz | 0.525 | ||||
| 弯曲强度 Flexural Strength | Warp | 2.4.4 | As Received | N/mm² | 200 | |
| Fill | 180 | |||||
| 耐燃性 Flame Resistance | UL-94 | A&E-4/125 | — | V-0 | ||
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