NY-P5/NY-P5P
Excellent electrical and thermal reliability properties
Low Dk (Dk 3.10@10GHz，RC65%，SPDR)
Low Df (Df 0.0007@10GHz，RC65%，SPDR)
Lead Free reflow process compatible
Superior PTH reliability and anti-CAF capability
Stable and flat Dk/Df performance and excellent moisture resistance
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服务器Server
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基站Base Station
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数据中心data center
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背板Backplane
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高性能计算机High Performance Computer
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超级核心路由器和交换机Super Core Router and Switch
NY-P5基板典型性能 Typical Properties for NY-P5 Laminate
| 属性 Property | 项目 Item | 测试方法 IPC-TM-650 | 测试条件 Test Condition | 单位 Unit | 典型值 Typical Value | |
| 热性能 Thermal | 玻璃态转换温度 Tg Glass Transition Temperature | 2.4.25 | DSC | ℃ | \ | |
| 2.4.24 | TMA | ℃ | 190 | |||
| 2.4.24.4 | DMA | ℃ | 200 | |||
| X/Y轴热膨胀系数 X/Y-axis CTE | 2.4.24.5 | ＜Tg,TMA | PPM/℃ | 7\9 | ||
| Z轴热膨胀系数 Z-axis CTE | 2.4.24 | ＜Tg,TMA | PPM/℃ | 60 | ||
| ＞Tg,TMA | PPM/℃ | 210 | ||||
| 2.4.24 | 50~260℃ | % | 2.0 | |||
| 热分解温度 Td Decomposition Temperature | 2.4.24.6 | TGA(5%W.L) | ℃ | 380 | ||
| 耐热性 T288 Thermal Resistance | 2.4.24.1 | Clad | Min | ＞60 | ||
| Etched | Min | ＞60 | ||||
| 电性能 Electrical | 介电常数 Dk (R/C:65%) Permittivity | 10GHz | SPDR method | C-24/23/50 | — | 3.10 |
| 介质损耗 Df (R/C:66%) Loss Tangent | 10GHz | SPDR method | C-24/23/50 | — | 0.0007 | |
| 体积电阻 Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ-cm | 2.4×109 | ||
| 表面电阻 Surface Resistivity | MΩ | 1.9×108 | ||||
| 物理性能 Physical | 吸水率 Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.03 | |
| 剥离强度(HTE) Peel Strength | 1oz | 2.4.8 | As Received | N/mm | 0.65 | |
| 剥离强度(RTF) Peel Strength | 1oz | \ | ||||
| 剥离强度(HVLP) Peel Strength | 1oz | 0.6 | ||||
| 弯曲强度 Flexural Strength | Warp | 2.4.4 | As Received | N/mm² | 200 | |
| Fill | 175 | |||||
| 耐燃性 Flame Resistance | UL-94 | A&E-4/125 | — | V-0 | ||
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